aos semiconductor product reliability report aon6414al, rev b plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
this aos product reliability report summarizes the qualification result for aon6414al. accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final el ectrical test result confirms that aon6414al passes aos quality and reliability requirements. th e released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. table of contents: i. product description ii. package and die information iii. environmental stress test summary and result iv. reliability evaluation i. product description: the aon6414al uses advanced trench technology to pr ovide excellent r ds(on) , low gate charge. this device is suitable for use as a high s ide switch in smps and general purpose applications. -rohs compliant -halogen free detailed information refers to datasheet. ii. die / package information: aon6414al process standard sub-micron low voltage n channel package type dfn 5x6 lead frame cu die attach ag epoxy bonding wire cu wire mold material epoxy resin with silica filler msl (moisture sensitive level) level 1 based on j-std-020 note * based on information provided by assembler and mol d compound supplier
iii. result of reliability stress for aon6414al test item test condition time point lot attribution total sample size number of failures standard msl precondition 168hr 85 c /85%rh +3 cycle reflow@260c - 11 lots 1815 pcs 0 j esd22 - a113 htgb temp = 150 c, vgs=100% of vgsmax 168 hrs 500 hrs 1000 hrs 2 lot s 1 lot 1 lot 308 pcs 77pcs / lot 0 jesd22 - a108 htrb temp = 150 c, vds=80% of vdsmax 168 hrs 500 hrs 1000 hrs 2 lots 1 lot 1 lot 308 pcs 77pcs / lot 0 jesd22 - a108 hast 130 +/- 2 c, 85%rh, 33.3 psi, vgs = 100% of vgs max 100 hrs 1 1 lots (note a*) 605 pcs 55pcs / lot 0 jesd22 - a110 pressure pot 121 c, 29.7psi, rh=100% 96 hrs 1 1 lots (note a*) 605 pcs 55pcs / lot 0 jesd22 - a102 temperature cycle -65 c to 150 c, air to air 250 / 500 cycles 1 1 lots (note a*) 605 pcs 55pcs / lot 0 jesd22 - a104 note a: the reliability data presents total of available g eneric data up to the published date. iv. reliability evaluation fit rate (per billion): 13 mttf = 9101 years the presentation of fit rate for the individual pro duct reliability is restricted by the actual burn-in sample size of the selected product (aon641 4al). failure rate determination is based on jedec standard jesd 85. fit means one fail ure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 1.83 x 10 9 / [ 2x (4x77x168+2x77x500+2x77x1000) x258 ] = 13 mttf = 10 9 / fit = 7.97 x 10 7 hrs = 9101 years chi2 = chi squared distribution, determined by the numbe r of failures and confidence interval n = total number of units from htrb and htgb tests h = duration of htrb/htgb testing af = acceleration factor from test to use conditions ( ea = 0.7ev and tuse = 55c) acceleration factor [af ] = exp [ea / k (1/tj u C 1/tj s)] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 258 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u = the use junction temperature in degree (kelvin), k = c+273.16 k = boltzmanns constant, 8.617164 x 10 -5 ev / k
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